Characterization of microstructure and property of strenght Cu/W composite layers
Wojciech Lisowski, Jan Płowiec, Wojciech L. Spychalski, Maria Trzaska Krzysztof J. Kurzydłowski Politechnika Warszawska, Wydział Inżynierii Materiałowej, ul. Wołoska 141, 02-507 Warszawa, Poland
Quarterly No. 2, 2007 pages 71-75
DOI:
keywords: electrochemical method, composite Cu/W layers, test of tension
abstract The paper concerns of composite Cu/W layers produced by electrochemical reduction method on a copper substrate. The investigations are aimed on determination such defining optimal parameters of coating process leading to appropriate of the layers. The results of investigations of surface topography as well as of the structure of the obtained layers, by electron scan-ning microscopy are presented. Structure and thickness of produced layers and distribution of tungsten particles in the layers have been analyzed. By using the method of quantitative metallography the chemical compositions of the produced layers and substrate were determined. Volume fraction of tungsten particles was identified by computer analysis and established at 18%. Scanning and atomic force microscopy images of the layer are presented. The images show differences in topography of the surface of substrate and layers. The static tension tests of the flat samples were carried out using Q-TEST machine. Moreover, the tested samples after the static tension test are demonstrated. Electron scanning microscopy images of samples are also presented.